| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is small, light, and thin, and where resin does not infiltrate into a light receiving part of a semiconductor element and thus light receiving characteristics are not deteriorated. SOLUTION: This device comprises the semiconductor element 1 where the light receiving part 2 is equipped at a center region of a lower surface and an electrode 5 is formed at a peripheral region of the lower surface, a transparent member 3 where an outline dimension is larger than the light receiving part 2 and smaller than the lower surface of the semiconductor element 1, and a wiring board 7 where a through-hole is equipped which aperture dimension is larger than the transparent member 3 and smaller than the lower surface of the semiconductor element 1, and an electrode pad is equipped at a periphery of the through-hole of a top surface corresponding to the electrode 5. The transparent member 3 is attached to the lower surface of the semiconductor element 1 so as to cover the light receiving part 2, the transparent member 3 is inserted into the through hole, and the electrode 5 of the semiconductor element 1 and the electrode pad of the wiring board 7 are connected by using a conductive member so as to locate the lower surface of the member 3 within the through- hole.
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