| 摘要 |
PROBLEM TO BE SOLVED: To obtain a ceramic wiring board which can divide multiple ceramic wiring board along division grooves easily and accurately without burrs and cracks and can seal electronic components stably with airtightness over the long term without exfoliation of a materialized layer for sealing after sealing a lid. SOLUTION: A frame sealing metalized layer 5 is formed on a plurality of wiring board regions 2, which are aligned and formed on a main surface of a substantially tubular ceramic mother board 1. Division grooves 3 dividing into individual regions reformed on the mother board 1. Non forming part 6 of the layer 5 is provided on both ides of the division grooves 3 so that each wiring board region 2 can be divided along division grooves 3 easily and accurately without burrs and cracks. Multiple ceramic wiring board can be provided and seal electronic components stably with airtightness in the long term without exfoliation of the layer 5 after sealing the lid.
|
