| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and an electronic apparatus capable of relatively easily inspecting with high sensitivity a solder non-melting failure of a soldering joint being composed of an electrode solder of the electronic apparatus and soldering land of the circuit board by a nondestructive way without changing a structure and a shape of an electrode of the electronic apparatus, as well as an inspection method of the soldering joint of the circuit board and the electronic apparatus. SOLUTION: At least two or more electrically independent soldering lands 201, 202 are provided on a position corresponding to at least one soldering electrode 8 among plural soldering electrodes on BGA 7. Each soldering land 201, 202 is connected with probing lands 201, 502 with wiring 401, 402, respectively.
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