发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed circuit board(PCB) of which the loop inductance can be reduced, and the manufacturing method of the PCB. SOLUTION: As a chip capacitor 20A is arranged within the PCB 10, the distance between a IC chip 90 and chip capacitor 20A becomes shorter, and so the loop inductance can be reduced. Also, the chip capacitor 20A and chip resistor 20B are arranged within a thick core board 30, the PCB is free from being thicker. As the chip resistor 20B is arranged within the core board 30, high integration of the PCB can be realized.</p>
申请公布号 JP2002043754(A) 申请公布日期 2002.02.08
申请号 JP20000221347 申请日期 2000.07.21
申请人 IBIDEN CO LTD 发明人 YAHASHI HIDEO;SHIRAI SEIJI;ITO KATSUTOSHI
分类号 H05K1/11;H05K1/18;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
代理机构 代理人
主权项
地址