SILICON WAFER AND METHOD OF HEAT TREATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of heat treating a silicon wafer and a silicon wafer which provides good characteristics and a reliability of a device built on the surface of the silicon wafer and can improve the yield without fear of dislocations, etc., on the wafer surface. SOLUTION: The silicon wafer heat treating method is characterized in that a silicon wafer doped with nitrogen is subjected to quickly heating and quickly cooling.