发明名称 METHOD AND DEVICE FOR DEPOSITING SPUTTER FILM
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for depositing a sputter film, which can improve an availability factor. SOLUTION: The method comprises cleaning the surface of the target 16 by means of expanding the magnetic field along the face of the target 16 wider than the field in depositing the sputter film on a glass substrate, after forming a film with constituent of a target 16 on a predetermined number of glass substrates by sputtering using a magnetic field. Thus, the surface of the target 16 on which particles stick, including uneroded region 22 can be cleaned without opening to air, which results in the improvement of the availability factor.
申请公布号 JP2002038264(A) 申请公布日期 2002.02.06
申请号 JP20000224648 申请日期 2000.07.25
申请人 TOSHIBA CORP 发明人 HIDAKA KOJI
分类号 C23C14/35;C23C14/00;(IPC1-7):C23C14/35 主分类号 C23C14/35
代理机构 代理人
主权项
地址