| 摘要 |
PROBLEM TO BE SOLVED: To provide a sample preparation method, in which a sample can be manufactured with high operating efficiency and which does not require a skilled technique in its preparation. SOLUTION: A region, excluding a prescribed region including a part, to be observed as viewed from a plane from among a part 12 on one side in the thickness direction of a semiconductor substrate 100 is shaved by a prescribed size in the thickness direction. A protrusion 14, which includes the part to be observed is formed on one side in the thickness direction of the semiconductor substrate 100. A region, in which a dummy pattern used to cut off the transmission of an electron beam in a subsequent observation by a TEM is irradiated with a selective high-density excimer laser from the upper part of the protrusion 14, i.e., from a direction parallel to the thickness direction of the semiconductor substrate 100, and a part of the protrusion 14 and the dummy pattern are removed. An operation is performed to the semiconductor substrate 100 is subjected to anisotropic etching, and the protrusion 14 including the part to be observed is made to be thin.
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