| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for forming a film excellent in heat resistance, low permittivity, and copper diffusion-preventing performances as an interlayer insulating film in a semiconductor element or the like. SOLUTION: The composition for forming a film comprises (A) both or either of an aromatic polyarylene and an aromatic polyarylene ether, (B) a compound capable of forming a complex with copper and (C) an organic solvent. The material for forming an insulating film comprises this composition for forming a film.
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