发明名称 THERMOPLASTIC SUBSTRATE AND SILVER HALIDE PHOTOSENSITIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic substrate easy to be cut, with reduced occurrence of flashes by slitting and drilling, and to provide a silver halide photosensitive material with scarce troubles on pictures. SOLUTION: The thermoplastic substrate has breaking strength of 5 to 18 kg/mm2 both in TD and MD directions, elongation at break of 20 to 140% both in TD and MD directions, and deviation of crack tear resistance of 0.3 to 1.8 kg/mm2 both in TD and MD directions. The silver halide photosensitive material utilizes the support.
申请公布号 JP2002037897(A) 申请公布日期 2002.02.06
申请号 JP20000220731 申请日期 2000.07.21
申请人 FUJI PHOTO FILM CO LTD 发明人 HASHIMOTO NARIKAZU
分类号 G03C1/795;B29C55/02;C08J5/18;G03C3/00;(IPC1-7):C08J5/18 主分类号 G03C1/795
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