发明名称 |
Electronic surface mount package |
摘要 |
An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
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申请公布号 |
US6344785(B1) |
申请公布日期 |
2002.02.05 |
申请号 |
US19970906952 |
申请日期 |
1997.08.06 |
申请人 |
HALO ELECTRONICS, INC. |
发明人 |
LU PETER;HEATON JEFFREY;HEATON JAMES W.;PAO PETER LOH HANG;LAM ROBERT LOKE HANG;SUN TSANG KEI |
分类号 |
H01F17/06;H01F27/02;H01F27/29;H01F41/00;H01F41/10;H05K3/30;H05K3/34;(IPC1-7):H01F27/02 |
主分类号 |
H01F17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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