| 摘要 |
An optical semiconductor device for surface mounting includes a semiconductor chip having a light emitting function or a light receiving function and two electrodes of the semiconductor chip sealed into a light-permeable resin package. The electrodes have tip surfaces externally exposed from the sides at the four corners of the resin package. The tip surfaces 4 of the electrodes are located on only the sides 4a of the resin package, but not located on the bottom thereof. In this configuration, when the optical semiconductor device for surface mounting is arranged on the solder paste on a board, its stand-up due to the contraction of the solder paste after the reflow can be avoided. |
