INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE: An integrated circuit package is provided to have an integrated circuit chip mounted on a conductive slag and electrically connected to the slag. CONSTITUTION: An integrated circuit chip(112) is combined with a conductive slug(114). A conductive element is expanded from the integrated circuit chip(112) to the conductive slug(114). A substrate package is combined with the conductive slug(114). A substrate includes the first conductive layer electrically combined with the integrated circuit chip(112). The substrate package has the second conductive layer electrically connected with the conductive slug(114). The first conductive layer is electrically separated from the second conductive layer in the substrate package.