CONTACT STRUCTURE OF INTERCONNECTION, MANUFACTURING METHOD THEREOF, THIN FILM TRANSISTOR SUBSTRATE INCLUDING THE SAME AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a contact structure of an interconnection is provided to simplify a manufacturing process and to reduce manufacturing cost, by minimizing contact resistance in a contact part, by guaranteeing reliability of the contact part including a pad part and by using aluminium or aluminium alloy of low resistance to form the interconnection. CONSTITUTION: The interconnection is formed on a substrate by using an aluminium-based metal. An insulation layer covering the interconnection is stacked. The insulation layer is patterned to form a contact hole exposing the interconnection. A transparent conductive layer electrically connected to the interconnection is formed. The interconnection is cleaned.