摘要 |
PURPOSE: A structure of a high density lead frame is provided to reduce package defects, by improving the structure of the high density lead frame(HDL) so that flash remaining in the outer of a package after a molding process is minimized. CONSTITUTION: A die pad(6) is used for settling a semiconductor chip. Inner leads(1) are disposed on the circumference of the die pad, separated from each other. Outer leads(2) are extended to the outside of the inner leads. A dam bar(5) is located on the boundary between the inner leads and the outer leads. A groove(3) is located inside the dam bar, not getting out of a molding region(M).
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