发明名称 |
METHOD OF DEPOSITION OF DIELECTRIC FILM |
摘要 |
PURPOSE: A method of forming dielectric films is provided to have low dielectric constant and improve film characteristics that are also suitable for use as ARCs. CONSTITUTION: The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a dopant in the presence of an electric field. The as-deposited silicon carbide layer has a compressibility that varies as a function of the amount of dopant present in the gas mixture during layer formation.
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申请公布号 |
KR20020010073(A) |
申请公布日期 |
2002.02.02 |
申请号 |
KR20010035740 |
申请日期 |
2001.06.22 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
CAMPANA-SCHMITT FRANCIMAR;LEE JIA;NEMANI SRINIVAS D.;SUGIARTO DIAN;XIA LI-QUN;XU PING;YIEH ELLIE |
分类号 |
C23C16/42;C23C16/32;H01L21/20;H01L21/314;H01L21/768;H01L23/522;(IPC1-7):H01L21/20 |
主分类号 |
C23C16/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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