发明名称 METHOD OF DEPOSITION OF DIELECTRIC FILM
摘要 PURPOSE: A method of forming dielectric films is provided to have low dielectric constant and improve film characteristics that are also suitable for use as ARCs. CONSTITUTION: The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a dopant in the presence of an electric field. The as-deposited silicon carbide layer has a compressibility that varies as a function of the amount of dopant present in the gas mixture during layer formation.
申请公布号 KR20020010073(A) 申请公布日期 2002.02.02
申请号 KR20010035740 申请日期 2001.06.22
申请人 APPLIED MATERIALS INC. 发明人 CAMPANA-SCHMITT FRANCIMAR;LEE JIA;NEMANI SRINIVAS D.;SUGIARTO DIAN;XIA LI-QUN;XU PING;YIEH ELLIE
分类号 C23C16/42;C23C16/32;H01L21/20;H01L21/314;H01L21/768;H01L23/522;(IPC1-7):H01L21/20 主分类号 C23C16/42
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