发明名称 |
APPARATUS FOR ELECTRICALLY INTERCONNECTING ELECTRONIC CIRCUIT SUBSTRATES |
摘要 |
There is provided an adapter for electrically interconnecting a first circui t substrate with a second circuit substrate. The adapter includes a first electrical connector which is operatively connected to the first circuit substrate. The first electrical connector mates with a corresponding second electrical connector which is operatively connected to the second circuit substrate. A longitudinal guide is provided with the adapter for receiving an edge of one of the first circuit substrate and the second circuit substrate. The longitudinal guide is positioned such that when the edge of one of the first circuit substrate and the second circuit substrate is received therein, relative translation of the first circuit substrate with respect to the second circuit substrate directs the first electrical connector and the second electrical connector together to thereby provide electrical engagement therebetween. Th e adapter would permit a first existing circuit substrate of given dimensions to be housed in an equipment enclosure intended for a second existing circuit substrate of larg er dimensions than the first existing circuit substrate.
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申请公布号 |
CA2315386(A1) |
申请公布日期 |
2002.02.01 |
申请号 |
CA20002315386 |
申请日期 |
2000.08.01 |
申请人 |
ALCATEL NETWORKS CORPORATION |
发明人 |
BUNDZA, NICHOLAS ADAM |
分类号 |
H01R13/518;(IPC1-7):H01R12/16;H01R13/629 |
主分类号 |
H01R13/518 |
代理机构 |
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