| 摘要 |
PURPOSE: A wafer cleaning equipment and a cleaning method thereof are provided to remove impurities, slurries, residues, and particles from a wafer and prevent the formation of water droplet. CONSTITUTION: A cleaning chamber unit(100) is formed with the first chamber(110) with an opened upper portion(111), the second chamber(120) with an opened lower portion facing the first chamber(110), and a slide unit(130) for changing locations of the first and the second chambers(110,120). The first deionized water supply/drain unit(500) is used for supplying the first deionized water to the first chamber(110) or draining the deionized water from the first chamber(110). A dry gas supply unit(600) is used for supplying a dry gas to the second chamber(120). A wafer up-down unit(200) is used for transferring one or more wafer into the first deionized water and lifting the wafer to the second chamber(120). The second deionized water streaming unit(300) is used for injecting the second deionized water. A collection unit(400) is used for collecting the second deionized water and impurities adhered on the wafer.
|
