| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead wire free from the generation of lift-off at the time of soldering, excellent in solder wettability and further excellent in bending workability and to provide electronic parts using the same. SOLUTION: A single Sn-Bi alloy layer 2 is formed on an electrically conductive substrate 1, also, the average concentration of Bi in the Sol-Bi alloy layer is 0.1 to 1.0 wt.%, or the lead wire is composed of the electrically conductive substrate 1, an Sn layer 2A formed on the electrically conductive substrate and an Sn-Bi alloy layer 2B formed on the Sn layer and having a Bi concentration of 1 to 5 wt.%.
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