| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having excellent chemical resistance, dielectric characteristic, low water absorptivity, heat resistance, flame retardant property and mechanical characteristic after curing. SOLUTION: The curable resin composition is produced by including (C) a silicate having an average particle diameter of 10μm or less in a composition consisting of (A) a functionalized polyphenylene ether based resin obtained by reacting a mixture containing a polyphenylene ether based resin (a) and at least one kind of a functionalized compound (b) having in its molecular structure (1) at least one of carbon-carbon double bond or triple bond and (2) at least one group selected from a group consisting of a carboxylic acid, an acid anhydride, an acid amide, an imide, an amino, a hydroxyl and a glycidyl group, and (B) a crosslinking component. |
