| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for cleaning a wafer treating apparatus, on which an adhesive material is fixed firmly in an area larger than the wafer contacting portion of the substrate and which can be improved in foreign matter removal efficiency by carrying the substrate in a wafer treating device without lowering the availability of the device, a method of manufacturing the substrate, and a method of regenerating the substrate. SOLUTION: The substrate catches foreign matters in a transfer system and a treatment unit by means of the adhesive material fixed firmly on the substrate, when the substrate is carried in the semiconductor manufacturing apparatus. The substrate can be manufactured by applying the adhesive material or sticking a double-coated adhesive tape to the surface of a wafer. In addition, the substrate can be regenerated by firmlyre-fixing the adhesive material on the surface of the wafer, after the adhesive material firmly fixed on the surface has been removed. |
