| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for temporarily bonding a board to a wall surface/ceiling, which can temporarily bond the board without using a double- faced adhesive tape, can correct the location of the board after bonding the same, enables bonding of the board only by pressing a single portion of the board when the board is temporarily bonded, unlike the double-faced adhesive tape which requires pressing of its entire surface, and allows even an unskilled worker to bond the board in the same manner as a skilled worker. SOLUTION: The method for temporarily bonding the board to the wall surface/ceiling is comprised of (a) the step of coating either the wall surface/ ceiling or the board or both of the same with a two-part acrylic adhesive, (b) the step of pressing the board surface onto a predetermined location of the wall surface/ceiling, and (c) the step of correcting the location of the board as needed.
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