METHOD FOR MANUFACTURING ELECTRO-OPTIC DEVICE, METHOD FOR CONNECTING TERMINAL, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To connect the terminals on a substrate and the terminals of a packaging base material with high accuracy. SOLUTION: The substrate 6a formed with the terminals 9 and the wiring board 11 having the terminals 11c for output are joined across an ACF 20. The pitch P2 of the terminals 11c for output vary from the pitch P1 of the terminals 9 by taking the deformation of the substrate 6a or the wiring board 11 in joining of both into consideration. Both terminals are connected to in the state that the pitch P1' of the terminals 9 and the pitch P2' of the terminals 11c for output are approximately the same by accompanying the deformation of the substrate 6a or the wiring board 11 which occurs at the joining described above.