发明名称 HEATED SUBSTRATE SUPPORT ASSEMBLY AND METHOD
摘要 <p>A substrate support assembly 30 comprises a support 38 with a substrate supporting surface 55 and a collar 130 comprising an electrical connector, whereby a voltage may be supplied to the collar 130 through the electrical connector. The collar 130 may pass a current therethrough to resistively heat the collar to a predetermined temperature before substrate processing. In another version, the temperature of the collar 130 may be controlled during and/or before substrate processing.</p>
申请公布号 WO2002009162(A2) 申请公布日期 2002.01.31
申请号 US2001041233 申请日期 2001.06.26
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