发明名称 METHOD FOR MANUFACTURING CONDUCTIVE MOLDING PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive molding product with high conductivity, high moldability, with high productivity. SOLUTION: This method for manufacturing the conductive molding product is such that (a) powder having an average particle size of 20-250 μm comprising thermoplastic resin powder, thermoplastic elastomer powder, or the blended powder of them, (b) low melting point metal powder having a melting point of 300 deg.C or lower and an average particle size of 5-150 μm are physically mixed, and the mixture is extrusion-molded or injection-molded in a temperature region of the melting point or lower of the low melting point metal or 30 deg.C or more lower than the melting point.
申请公布号 JP2002033019(A) 申请公布日期 2002.01.31
申请号 JP20000215612 申请日期 2000.07.17
申请人 MITSUBISHI PLASTICS IND LTD 发明人 HAYASHI TATSUYA
分类号 C08J5/00;B29C45/46;B29C45/78;B29C47/78;B29C47/92;B29K21/00;B29K103/06;C08K3/08;C08K3/10;C08L101/00;H01B1/22;H01B13/00 主分类号 C08J5/00
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