| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for the mounting of an electronic component wherein a shock is not given to the electronic component and the electronic component can be bonded surely to a component mounting position. SOLUTION: The electronic component 5 which is fed by a component feeder 7 is taken out by a suction nozzle 2 so as to be mounted on a board 3. A control part 6 is installed in such a way that the suction nozzle 2 is lowered to the side of the board 3 and that, at the point when the contact of the electronic component 5 sucked and held by the suction nozzle 2 with the component mounting position is sensed, the electronic component 5 is separated from the suction nozzle 2 so as to be mounted in the component mounting position on the board 3. |
