发明名称 |
Variable melting point solders and brazes |
摘要 |
Variable melting point solders and brazes having compositions comprising a metal or metal alloy powder having a low melting point with a metal powder having a higher melting point. Upon heating, in-situ alloying occurs between the low and high melting point powders such that solidification occurs at the solder or braze temperature thus creating a new, higher solidus (or melting) temperature with little or no intermetallic formation. A solder comprising Sn powder mixed with a Sn-Bi eutectic powder having a composition of 63 wt % Sn, 57 wt % Bi such that the bulk composition of the mixture is 3 wt % BS has an initial melting point of 140° C. and a re-melt temperature of 220° C. after heating due to in-situ alloying. A composition of Pb powder mixed with a Pb-Sn eutectic powder having a composition of 62 wt % Sn:58 wt % Pb such that the bulk composition of the mixture is 15 wt % Sn has an initial melting point of 183° C. and a re-melt temperature of 250° C.
|
申请公布号 |
US2002012607(A1) |
申请公布日期 |
2002.01.31 |
申请号 |
US20010863763 |
申请日期 |
2001.05.24 |
申请人 |
CORBIN STEPHEN F.;MCISAAC DOUGLAS J.;QIAO XIN |
发明人 |
CORBIN STEPHEN F.;MCISAAC DOUGLAS J.;QIAO XIN |
分类号 |
B22F1/00;B23K35/02;B23K35/14;B23K35/26;B23K35/28;B23K35/30;H05K3/34;(IPC1-7):C22C19/03;C22C21/10 |
主分类号 |
B22F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|