Carrier and polishing apparatus

摘要

A carrier and a polishing apparatus are designed to improve the mass producibility of wafers while using a retainer ring formed by a soft material. A rubber sheet (4) is bonded to the bottom surface of a carrier body (2) of the carrier (1) to define a pressure chamber (R), a retainer ring (13) formed by a soft material such as EG is bonded to the bottom surface of the sheet (4). A margin block (40) is provided projecting out from the bottom side of the sheet (4), and the thickness of the retainer ring (13) is set to be substantially equal to the sum of the thickness (L1) of the margin block (40) and the thickness (L2) of the wafer (W).