| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board that can reliably prevent cracks in an interlayer-insulating layer, and at the same time burn out in a conductor pattern. SOLUTION: The multilayer printed-wiring board 1 has a plurality of conductor layers 2, the interlayer insulating layers 31 to 34 that are provided between the conductor layers 2, and solder resist 4 provided on the outermost surface. The outermost interlayer insulating layer 31 is a reinforcement layer 311 having a reinforcing material 5 for reinforcing the interlayer-insulating layer 31. |
