| 摘要 |
PROBLEM TO BE SOLVED: To improve the stability and the strength of connections on a wiring circuit board 1 having interlayer connecting means for connecting, by the thermocompression bonding, copper bumps 5 at their top faces 5a to a copper wiring film 3 on a board 2 surface, thereby connecting the wiring film 3 to a separate copper wiring film 6. SOLUTION: Copper bump connections 31 of a copper wiring film 3 each have a shape having a top end edge reaching a copper bump top face 5a or traversing across this face 5a. The bump connection 31 is formed e.g. like a mesh (see Fig. 31a). The copper bump 5 is preferably formed by roughing its top face or a surface including the top face to improve the connection performance.
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