| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that conventionally the package of a semiconductor element that is reduced in size and in thickness is difficult, because a substrate, a semiconductor element and a wire bonding loop are laid in a layer or that a special substrate having electrodes overlapping holes is required in case of such a structure as the semiconductor element is contained in the through-holes of the substrate, and to provide the package of a semiconductor element, having a simple structure and suitable for reduction in size and in thickness. SOLUTION: A semiconductor element 2 is contained in the through-holes 1a of a substrate 1 and wire bonded, using a metal wire 3 before being sealed with resin 4. The package is manufactured, using a collective substrate where a large number of product regions are arranged in lattice form. An adhesive tape is stuck to the lower surface of the collective substrate, and the hole 1a is provided with the bottom. Subsequently, the semiconductor element is bonded to the adhesive tape and is wire bonded, the upper surface is diced longitudinally and laterally by means of aggregates produced, by hardening the sealing resin 4 filling the upper surface thus obtaining a large number semiconductor packages in one time. Connection terminals can also be arranged on the upper surface of the substrate, by making a recess around the hole in the upper surface of the substrate and filling only that recess with sealing resin. |
