| 摘要 |
PROBLEM TO BE SOLVED: To effectively and with high precision mount electronic parts to a liquid crystal substrate, etc. SOLUTION: When electronic parts 2 such as TCP or the like are attracted by a part attracting head 11 and are positioned at predetermined positions of a substrate 3 for mounting, a connection tape 4 such as anisotropic conductive tape, or the like stuck onto the substrate 3 is heated by a heater 18, etc., mounted to a pedestal 18 of the substrate 3. As a result, a thermal expansion of a thin film-like part 21 made of a film-like polyimide resin to which chip parts 22 are mounted is restricted, and a pattern slippage of a lead 22a, a positioning mark 22b and the like formed in the film-like part 21 are restricted, so that a positioning mounting with high precision can be performed. |
