BONDING DEVICE AND BONDING METHOD FOR ELECTRONIC COMPONENT WITH BUMP

摘要

PROBLEM TO BE SOLVED: To provide a bonding device and a bonding method for an electronic component with bumps which can hold a substrate where the electronic component is bonded at a stable attitude and secure joining quality. SOLUTION: The bonding device which presses the electronic equipment 5 with the bumps against the packaged substrate 4 and bonds it by ultrasonic vibration after mounting the substrate 4 on a plate member 3a of an elastic material mounted on a substrate holding part and then placing the electronic component 5 on the substrate 4 presses the electronic component 5 by the bonding tool to elastically hold the substrate 4 by the plate member 3a. Consequently, the attitude of the substrate 4 is made stable at the bonding time to secure the joining quality.