| 摘要 |
PROBLEM TO BE SOLVED: To enable vertical heat treatment equipment which performs heat treatment on many semiconductor wafers in a reaction chamber while the wafers are held on a shelf-like holding tool and, at the same time, to widely form a treatment atmosphere having high temperature uniformity. SOLUTION: Between a lid body closing the lower end of the reaction chamber and the holding tool, a heating element unit constituted by enclosing a resistance heat generating wire composed of a high-purity carbon material in a quartz plate is provided, and a feeder protective tube is connected to the lower surface of the outer edge section of the heating element unit by passing the lower end of the protective tube through the lid body. In addition, a heat insulating unit containing a heat insulating member is provided below the heating element unit, and the protective tube and heat insulating unit are supported in a vertically movable state by means of an interlocking plate below the lid body so that the heights of the units may be adjusted. The holding tool is supported rotably to the lid body by a rotating shaft passed through the heating element and heat insulating units.
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