| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame which is used for the manufacture of an individual molding type resin-sealed semiconductor device and can prevent thin resin burrs from being produced on the surfaces of the terminals of the lead frame, when a semiconductor element is molded. SOLUTION: This lead frame is one, which is used for manufacturing a resin-sealed semiconductor device using a method, where a semiconductor element 4 is mounted on a die pad 3 supported by suspension leads of the lead frame. After terminal parts 5 of the lead frame are electrically connected with electrodes on the upper surface of the element 4 through metal thin wires 6, the element 4 is molded and thereafter, the element 4 is punched into the individual semiconductor device by a metal mold. The terminal parts 5 of the lead frame are bent downward and are made to incline. When the metal mold is set into molding forces 11 and 12, the degree of adhesive strength of the terminal parts 5 with respect to the molding force 11 is increased by a spring action. As a molding resin is prevented from entering the back sides of the terminal parts 5, the generation of thin resin burrs on the rears of the terminal parts 5 is reduced, and proper solderability at mounting of a substrate on the lead frame can be ensured.</p> |
