PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained.