| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus such as etching for manufacturing a printed wiring board or the like for coping with the increase in the number of functions and density, thin-line, and thinning by a plastic film, a glass fiber film, metal foil, or a sheet-like material such as paper. SOLUTION: A substrate transport path 1 penetrating a tank 2 from a wall surface including a bottom wall surface 18 at the side of a tank upper chamber 2a that is constantly filled with etching liquid and a ceiling wall surface 19 at the side of a lower chamber 2b, and etching liquid is jetted from a plurality of inclined slits 5 and 6 on the upper and lower wall surfaces into the substrate transport path 1 in the direction of the transport of substrates, thus lifting and carrying a substrate 3. Since the substrate 3 is carried in the flow of liquid, no wrinkles and hit mark are generated on the surface of the substrate 3 even if the substrate 3 is in a thin-film shape. Also, especially since the fine conductor circuit pattern of the printed-wiring board does not touch a device member, the circuit pattern cannot be damaged. Further, treatment by the etching liquid on the substrate surface can be made uniformly, the entire substrate surface can be treated uniformly.
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