DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce thermal stresses by making uniform the temperature distribution which is generated in the surface of a semiconductor wafer when the wafer is placed on a blade after the wafer is heat-treated. SOLUTION: The shape of the wafer placing portion of a blade 6 which transfers the semiconductor wafer is formed by copying the shape of the wafer so that the wafer 14 may come into contact with the whole surface of the portion. In addition, the portion has a plurality of slits 17 of <=20 mm in width.