| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate film forming method for filling a recessed part of a substrate where the recessed part such as a groove and a hole for wiring pattern is formed and a barrier layer is formed on the inner surface of the recessed part in the center without the occurrence of seams and voids. SOLUTION: In this substrate film forming method, a film is formed on the surface of a substrate where fine recessed parts of a wiring pattern are formed on the surface, and the barrier layer 6 is formed on the inner face of the recessed part 2. A film is formed by changing active degrees on the sidewall of the recessed part 2 and the barrier layer 6 surface of the base. Thus, a film can be formed (filling of the recessed part) in the center of the recessed part 2 without the occurrence of seams and voids.
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