发明名称 CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which is superior in thermal impact resistance and moisture load resistance without generation of delamination during baking step and can be used advantagenously for forming an internal electrode, more specifically among laminated ceramic electronic components, such as laminated ceramic capacitor, etc., as well as laminated ceramic electronic component. SOLUTION: This conductive paste contains a conductive powder, made mainly of Ni, an organic vehicle, and a compound A which contains at least one kind among Mg, Ca and Ba, and is comprised of at least one kind of organic acid metal salt, metal organic complex salt and alkoxide, and a compound B, having a hydrolytic reaction group containing Al and/or Si, is adhered to the surface of the conductive powder.
申请公布号 JP2002025847(A) 申请公布日期 2002.01.25
申请号 JP20000204096 申请日期 2000.07.05
申请人 MURATA MFG CO LTD 发明人 MIYAZAKI TAKAHARU;YAMANA TAKESHI
分类号 H01G4/12;H01B1/22;H01G4/008;H01G4/30;H05K1/09;(IPC1-7):H01G4/12 主分类号 H01G4/12
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