发明名称 |
PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion device together with its manufacturing method whose manufacturing cost is low while it is appropriate for mass production. SOLUTION: A resin film of a transmission resin 10 is formed on a wafer 7 where a plurality of circuits are arrayed for an image sensor used for a photoelectric conversion element 5, and then jointed to a corresponding wiring board 1, in a wafer state or individual package state. |
申请公布号 |
JP2002026301(A) |
申请公布日期 |
2002.01.25 |
申请号 |
JP20000207002 |
申请日期 |
2000.07.07 |
申请人 |
TOSHIBA CORP |
发明人 |
OISHI MICHIKO;SEGAWA MASAO |
分类号 |
H01L27/14;H01L23/12;H01L31/02;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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