发明名称 PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a photoelectric conversion device together with its manufacturing method whose manufacturing cost is low while it is appropriate for mass production. SOLUTION: A resin film of a transmission resin 10 is formed on a wafer 7 where a plurality of circuits are arrayed for an image sensor used for a photoelectric conversion element 5, and then jointed to a corresponding wiring board 1, in a wafer state or individual package state.
申请公布号 JP2002026301(A) 申请公布日期 2002.01.25
申请号 JP20000207002 申请日期 2000.07.07
申请人 TOSHIBA CORP 发明人 OISHI MICHIKO;SEGAWA MASAO
分类号 H01L27/14;H01L23/12;H01L31/02;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/14 主分类号 H01L27/14
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