| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board wherein disconnection and short circuit are not caused when a heat sink having burrs on edges is attached, and warpage is not developed during heat generation. SOLUTION: The heat sink 3 is bonded on a driver IC board 1 by using adhesive agent 36 having high thermal conductivity, in such a manner that protrusions 34, 35 face the driver IC board 1. The burrs which are generated on the heat sink 3 by press punching work face the driver IC board 1, but the driver IC board 1 is not scratched by the burrs, since the protrusions 34, 35 are higher than the height of the burrs. |
