| 摘要 |
PROBLEM TO BE SOLVED: To provide a Hall element where defective caused by displacement of a mold is reduced. SOLUTION: Sizes W1 and L1 at a mold abutting surface of an upper mold package 1 is set smaller than sizes W2 and L2 of a lower mold package 2 by considering displacement amount of a mold. Thus, no upper mold package 1 extrudes beyond the lower mold package 2 for less variation in entire dimension. |
