MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the reliability of connection between bump electrodes of a semiconductor chip and electrode pads of a wiring board when the semiconductor chip is mounted on the wiring board by a flip-chip way through the bump electrodes. SOLUTION: When a silicon chip 6A having narrow-pitch Au bumps 9 is mounted on a module substrate 2, the difference in thermal expansion between the silicon chip 6A and module substrate 2 is taken into account and the total pitch of electrode pads 4a of the silicon chip 6A is previously made narrower than the total pitch of Au bumps 9 to prevent the Au bumps 9 and electrode pads 4a from shifting in position in a heat treatment, thereby securing the contact area between the both.