摘要 |
<p>PROBLEM TO BE SOLVED: To enable an active matrix board mounted with an electrostatic protective circuit to be manufactured in four photolithography processes. SOLUTION: A method of forming a TFT on an insulating board comprises a first process of laminating material films that form the TFT on the insulating board, a second process of forming a resist pattern having regions (an opening, a first resist mask 15, and a second resist mask) different from each other in thicknesses on the uppermost layer of the laminated material films by patterning, and a third process of processing some material films out of the laminated material films, using the resist pattern as an etching mask. By this method, a photolithography process for connecting a lower first conductive layer such as the gate electrode of the TFT and an upper second conductive layer such as the diameter.drain electrode of the TFT together can be shortened.</p> |