发明名称 METHOD OF MANUFACTURING ACTIVE MATRIX BOARD
摘要 <p>PROBLEM TO BE SOLVED: To enable an active matrix board mounted with an electrostatic protective circuit to be manufactured in four photolithography processes. SOLUTION: A method of forming a TFT on an insulating board comprises a first process of laminating material films that form the TFT on the insulating board, a second process of forming a resist pattern having regions (an opening, a first resist mask 15, and a second resist mask) different from each other in thicknesses on the uppermost layer of the laminated material films by patterning, and a third process of processing some material films out of the laminated material films, using the resist pattern as an etching mask. By this method, a photolithography process for connecting a lower first conductive layer such as the gate electrode of the TFT and an upper second conductive layer such as the diameter.drain electrode of the TFT together can be shortened.</p>
申请公布号 JP2002026333(A) 申请公布日期 2002.01.25
申请号 JP20000209994 申请日期 2000.07.11
申请人 NEC CORP;NEC KAGOSHIMA LTD 发明人 HAYASE TAKASUKE;TANAKA HIROAKI;KIDO SHUSAKU;HARANO TOSHIHIKO
分类号 G02F1/136;G02F1/1362;G02F1/1368;G03F1/40;G03F1/68;G03F7/20;G09F9/30;H01L21/027;H01L21/336;H01L27/12;H01L29/417;H01L29/45;H01L29/786;(IPC1-7):H01L29/786;G03F1/08 主分类号 G02F1/136
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