发明名称 ELECTRONIC COMPONENT AUTOMATIC INSTALLATION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component automatic installation apparatus which can supply a large number of electronic components and install them at a high speed. SOLUTION: A component supplying section comprises: a component transportation path 112 for supplying electronic components in an aligned state; and a separation and delivery means 20 which separates a specified plural number of electronic components out of a plurality of electronic components stored in the component transportation path, and then delivers the separated electronic components to a component installation section. The component installation section comprises: a path means 20 which receives a specified plural number of electronic components from the component supplying section and stores them, and at the same time, sends electronic components left over after installation of electronic components back to the component supplying section; a movement means 8 which moves the path means to a component installation position on a printed wiring board 10, and then moves it back to the component supplying section after installation of electronic components; a positioning means 8 which fetches the electronic components stored in the path means one by one and then positions them on specified places on the printed wiring board; and a component installation means for installing the positioned electronic components at specified places one by one.
申请公布号 JP2002026584(A) 申请公布日期 2002.01.25
申请号 JP20000210892 申请日期 2000.07.12
申请人 POPMAN:KK 发明人 SHIMADA KATSUMI;SHODA DAIZO
分类号 H05K13/02;H05K13/00;H05K13/04 主分类号 H05K13/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利