发明名称 Substrate processing method, substrate processing apparatus and substrate carrying method
摘要 The present invention is a method of performing processing for a substrate including the step of carrying the substrate, which has been pretreated, to a heat treatment unit for heating the substrate, prior to supplying a treatment solution to the substrate to perform solution treatment, in which the carrying is performed such as to fix a period after the pretreatment for the substrate is completed and before it is carried to the heat treatment unit. According to the present invention, for example, in a lithography process, the substrate is carried such as to fix the period after exposure processing that is the pretreatment and before the substrate is carried to the heat treatment unit where heat treatment that is the following treatment is performed, whereby the degrees of chemical reaction of coating films by the exposure processing become uniform between the substrates.
申请公布号 US2002009902(A1) 申请公布日期 2002.01.24
申请号 US20010906695 申请日期 2001.07.18
申请人 HASHIGUCHI HIROHARU;OKAMURA KOUJI 发明人 HASHIGUCHI HIROHARU;OKAMURA KOUJI
分类号 H01L21/00;(IPC1-7):H01L21/26 主分类号 H01L21/00
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