发明名称 |
NOVEL ARYL ESTER COMPOUND, ITS PRODUCTION PROCESS , EPOXY RESIN COMPOSITION USING SAID COMPOUND, AND COPPER-CLAD LAMINATE USING THE EPOXY RESIN COMPOSITION |
摘要 |
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: with a carbonyl compound represented by the general formula: which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.
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申请公布号 |
US2002010288(A1) |
申请公布日期 |
2002.01.24 |
申请号 |
US19970885191 |
申请日期 |
1997.06.30 |
申请人 |
UEDA YOUICHI;ENDO YASUHIRO;SHIBATA MITSUHIRO;YAMASAKI KAORI |
发明人 |
UEDA YOUICHI;ENDO YASUHIRO;SHIBATA MITSUHIRO;YAMASAKI KAORI |
分类号 |
C07C69/017;C07D311/60;C08G59/06;C08G59/22;C08G59/38;C08G59/42;H01L23/498;H01P1/04;H01P1/383;H01P3/16;H05K1/03;(IPC1-7):C08G59/00 |
主分类号 |
C07C69/017 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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