| 摘要 |
The invention relates to a semiconductor rectifier in a special mounting arrangement. The following alloys are given as examples suitable for parts of the assembly. (i) 54 per cent Fe, 29 per cent Ni, and 17 per cent Co and (ii) 58 per cent Fe, and 42 per cent Ni. A solder having a M.P. of 103 DEG C., which may be utilized in the construction consists of 53.9 per cent Bi, 29.6 per cent Sn and 24.5 per cent Cd. |
