THERMOSETTING RESIN COMPOSITION, ITS CURED SUBSTANCE AND CIRCUIT BOARD CONTAINING ITS CURED SUBSTANCE

摘要

PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition giving a cured substance excellent in adhesion and moisture-resistance as well as excellent in a dielectric characteristic (low dielectric constant) and thermostability. SOLUTION: The thermosetting resin composition contains: a copolymer (A) including acenaphthylene constitution unit (a) and glycidyloxymethyl styrene constitution unit (b); a compound (B) having at least two phenolic hydroxyl groups in the molecule; and a curing agent (C). The cured substance is obtained by thermosetting such a thermosetting resin composition. The circuit board contains the cured substance as an insulating film between layers or a flattened film.