SPUTTERING SYSTEM, SPUTTERING BACKUP UNIT, AND METHOD FOR CONTROLLING SPUTTERING

摘要

PROBLEM TO BE SOLVED: To keep film deposition rate constant without changing electric power consumption. SOLUTION: In a vacuum chamber, high-frequency power is supplied to a target electrode and a substrate electrode to produce plasma and a target is sputtered by ions in the plasma to carry out film deposition on a substrate. The amount of impurities inside the vacuum chamber is detected. According to the resultant detected value, the phase difference of the high-frequency power supplied to the respective electrodes is controlled.